Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging) (Emerging Technology in Advanced Packaging, 1, Band 1) | Kaicus Deutschland

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging) (Emerging Technology in Advanced Packaging, 1, Band 1)

160.49 EUR

Marke: Balde, John W.
ISBN: 146134977X
MPN: 266 black & white illustrations, biograp
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